ASAN, South Korea — Samsung Electronics is accelerating its strategic push to recapture the top spot in the global High Bandwidth Memory (HBM) market. The tech giant is channeling a massive 46 trillion won investment into its advanced packaging hub in Onyang, aiming to make it a primary manufacturing base for next-generation HBM4E chips by 2028.

During a groundbreaking ceremony for the Chungcheong Mega-Project held at the Onyang campus, Samsung Executive Chairman Lee Jae-yong shared the company’s ambitious roadmap with South Korean President Lee Jae-myung. The event featured a prominent display showcasing a prototype of the 7th-generation HBM4E, signaling the company's strong commitment to leading the advanced AI memory sector. President Lee further endorsed the initiative by writing "Mega-Project, Ultra-Gap Powerhouse Republic of Korea" on the commemorative exhibition panel.

Transitioning to an AI Semiconductor Heartbeat

Historically known as a hub for standard semiconductor assembly and final testing, the Onyang facility is undergoing a major technological transformation. Chairman Lee emphasized during his welcoming remarks that the campus is evolving into a core powerhouse for cutting-edge HBM—the critical engine driving modern artificial intelligence.

Scheduled for operation by June 2028, the newly expanded packaging line in Onyang will serve as a central pillar for HBM4E production. This plant follows another substantial expansion at Samsung's Cheonan campus, slated for completion by the end of next year. By synergizing these facilities with existing DRAM production lines in Giheung, Hwasong, and Pyeongtaek, Samsung aims to aggressively scale its capacity across upcoming generations, from HBM4 and HBM4E to the anticipated HBM5.

Samsung's prominent spotlight on HBM4E underscores its determination to bridge the gap with market leader SK Hynix. While SK Hynix currently holds a leading position in the HBM3E market, industry analysts project that the introduction of HBM4 and HBM4E could dramatically shift market dynamics.

According to market research firm TrendForce, average selling prices (ASPs) for HBM are expected to surge due to next-generation upgrades, with HBM4E anticipated to command significantly higher values than its predecessors. By securing early dominance in HBM4E, Samsung not only aims to reclaim the number-one market share but also expects a substantial boost in overall business profitability.

Part of a Broader 144 Trillion Won Regional Investment

The Onyang HBM fab expansion is part of a larger, sweeping investment initiative. Samsung announced a total commitment of 144 trillion won into the Chungcheong region—an increase of 4 trillion won from its initial July projections. The capital will fund vital infrastructure projects spanning advanced OLED displays, AI semiconductor packaging substrates, and next-generation batteries.

Reflecting on the transformation of the region, Chairman Lee noted, "Decades ago, this area consisted merely of barren hills and unpaved roads. Today, it stands as an advanced manufacturing center that completes the production of the 'rice of industry.' This mega-project is not merely an industrial strategy, but a historic endeavor to redraw the future of our nation."

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