SEOUL — Samsung Electronics is showcasing its cutting-edge artificial intelligence (AI) semiconductor solutions, including next-generation high-bandwidth memory (HBM) and mobile memory with integrated computing capabilities, at the 28th Semiconductor Exhibition (SEDEX 2026). The exhibition runs from October 14 to 16 at COEX in Gangnam-gu, Seoul. This year, Samsung has also introduced a dedicated "Semiconductor Cluster Zone" to highlight future production roadmaps, such as the upcoming Yongin National Industrial Complex.

SEDEX is South Korea's largest semiconductor-exclusive exhibition hosted by the Korea Semiconductor Industry Association (KSIA). This year's event features approximately 300 companies spanning the entire semiconductor ecosystem, including memory, system semiconductors, materials, components, and equipment. Samsung’s Device Solutions (DS) division, which oversees its semiconductor business, has been participating in the exhibition to present its products and technologies since 2012.

Under this year's theme of "AI System Design," Samsung organized its exhibition space into six distinct zones: Next-Generation Technology, Cloud AI, Edge AI, Physical AI, Semiconductor Cluster, and Win-Win Cooperation. The booth highlights comprehensive semiconductor solutions tailored for various AI application fields, leveraging the company's integrated capabilities spanning memory, logic design, foundry, and advanced packaging.

In the memory sector, Samsung showcased the HBM4E, a high-performance memory for AI applications representing the 7th generation of high-bandwidth memory. Following its achievement of shipping the world’s first HBM4E product samples last May, Samsung is currently developing the 8th-generation HBM5.

Samsung also displayed LPDDR-PIM, a mobile low-power DRAM that integrates processing functions directly inside the memory.

Additionally, the company introduced the zHBM (mock-up)—based on a 3D memory architecture that reduces the physical distance between processing units and memory—and zNAND-O (mock-up), a 3D NAND flash memory solution optimized for edge AI. The zHBM applies an innovative technology that advances beyond the traditional HBM structure of placing memory alongside an AI accelerator, instead stacking the HBM vertically directly on top of the AI accelerator to dramatically enhance performance.

In the foundry sector, Samsung exhibited the HBM4E base die applying a 4-nanometer process, "2.3D Cube-E" (an expandable ultra-high-density packaging technology based on silicon bridges), and "3D Cube-H" (a 3D packaging technology). An optical interconnect model that converts electrical signals into optical signals to transmit data also drew significant attention.

The System LSI division showcased its "DIMM Solution" providing integrated core chips necessary for the stable operation of server memory modules, the 200-megapixel image sensor "ISOCELL HPC," and the mobile processor "Exynos 2600."

Through its Semiconductor Cluster Zone, Samsung is detailing plans for the Yongin National Industrial Complex, which will be built with an investment of 360 trillion won. Samsung aims to begin site preparation and semiconductor plant construction next year, targeting the operation of its first production line by October 2029. Approximately 70 materials, components, equipment, and fabless companies are scheduled to move into the complex. A Samsung representative explained, "A semiconductor ecosystem where manufacturing, R&D, and partner companies are organically connected will be established," adding, "Along with the creation of the complex, we expect the expansion of living infrastructure—such as roads, transportation, housing, commercial, and cultural facilities—and the revitalization of the local economy."

Meanwhile, in the "Win-Win Cooperation Zone," Samsung presented support programs for partner companies and major shared growth achievements aimed at building a sustainable semiconductor ecosystem. Since founding "Hyupsunghoe," an association of partner companies, in 1981, Samsung has continuously pursued shared growth with its partners, currently operating diverse support programs spanning finance, technology, human resources, and education. As a result, the company earned the top rating in the "2025 Shared Growth Index Evaluation" by the Shared Growth Committee.

Samsung’s DS Division announced that it will operate a "Win-Win Cafe" delivering coffee trucks to major partner work sites over the next two months, and plans to host a "Movie Day" in December for approximately 30,000 partner employees and their families.

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